Welcome to Shenzhen Pingchen Semiconductor Technology Co., Ltd.!
Shenzhen Pingchen Semiconducto
Professional manufacturer of semiconductor packaging equipment

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Choosing Ping Chen is choosing a win-win situation


Has an experienced software and hardware R & D team for more than ten years
about us
  • company was founded on
  • 20

    Invention patents, software works
Shenzhen Pingchen Semiconductor Technology Co., Ltd. was established in 2015. It is a high-tech enterprise dedicated to the research and development, production, sales and service of semiconductor packaging equipment. The company introduces foreign advanced technology and develops a series of fully automatic die bonding machines suitable for SMA, SMB, SOD, TO, IGBT, COB, Mini Bridge, Circuit, BGA, IC and other package types.
  • Many places

    East and South China Operation Center
  • profession

    Senior R & D team
  • First

    Flip chip process
  • Autonomy

    China's first fully independent production line


Learn more about the latest news from the semiconductor packaging equipment industry

China's leading semiconductor packaging equipment company

Introduce foreign advanced technology and develop a series of fully automatic solid crystal machines
Official WeChat
Official website
  • 3-4 / F, Building B, No. 8 North District, Shangxue Science Park, Bantian Street, Longgang District, Shenzhen
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